• Ready for Advanced AI PC: Designed for the future of AI computing, with the power and connectivity needed for demanding AI applications
• Intel^® LGA 1700 Socket: Ready for 14^th, 13^th and 12^th Gen Intel^® processors
• Ultrafast Connectivity: PCIe 5.0, three PCIe 4.0 M.2, Realtek 2.5Gb Ethernet, USB 3.2 Gen 2×2 Type-C^®, front USB 3.2 Gen 1 Type-C^® and Thunderbolt™ (USB4^®) header support
• Comprehensive Cooling: VRM heatsinks, M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+
• ASUS OptiMem: Careful routing of traces and vias to preserve signal integrity for improved memory stability
• Aura Sync RGB Lighting: Onboard Addressable Gen 2 headers and Aura RGB header for RGB LED strips, easily synced with Aura Sync-capable hardware

FLEXIBILITY

Comprehensive controls form the foundation of the ASUS PRIME series. The PRIME B760-PLUS D4 motherboard packs flexible tools to tune every aspect of your system, enabling performance tweaks to perfectly match the way you work to maximize productivity.

Intelligent Control

ASUS Intelligent Control makes your PC smart. Along with taking care of complex tuning and dynamically optimizing essential aspects of your system, it offers intelligently simplified options for newcomers to PC DIY, as well as more comprehensive features for seasoned veterans.

All-Around Energy Efficiency

The Power Saving function contains several settings can easily optimize power consumption and maximize energy savings. You can enable a CPU power limit, darken Aura lighting, and set the fan profile to a power saving mode. You can also toggle the Power Saver plan that is built into Microsoft Windows.

COOLING

PRIME B760-PLUS D4 motherboard is engineered with multiple onboard heatsinks and an array of hybrid fan headers to ensure your rig stays cool and stable under intense workloads.

M.2 Heatsink

M.2 heatsink wards off throttling that can occur with M.2 storage during sustained transfers. The heatsink is held in place by captive screws, and these removable captive screws help reduce risk of drops or loss during heatsink removal.