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ASUS PRIME X670-P AMD Ryzen Motherboard

295.45 USD

Item Condition : New

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AMD Socket AM5 ATX Form Factor 4x DDR5 RAM Slots

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  • SKUsku_45_7667
  • ShippingOODDSS Economy Delivery 1KD,
  • Delivery Varies for items shipped from an international location
    Delivery within 4 business days
  • CountryKuwait
  • Return0 days

Details

ASUS Prime series motherboards are expertly engineered to unleash the full potential of AMD Ryzen 7000-series processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, PRIME X670-P provides users and PC DIY builders with a range of performance optimizations via intuitive software and firmware features.

FLEXIBILITY

Comprehensive controls form the foundation of the ASUS PRIME series. The PRIME X670 motherboard packs flexible tools to tune every aspect of your system, enabling performance tweaks to perfectly match the way you work to maximize productivity.

AI Cooling ll

AI Cooling II balances the thermals and acoustics of any build with a single click. A proprietary ASUS algorithm slashes unnecessary noise while running a quick stress test, and then it monitors CPU temperatures to dynamically adjust fans to optimal speeds.

UEFI BIOS

The renowned ASUS UEFI BIOS provides everything you need to configure, tweak and tune your system. It offers intelligently simplified options for PC DIY beginners, as well as comprehensive features for seasoned veterans.

Advanced Tuning for Serious Tweakers

An intuitive Advanced mode offered via the UEFI lets you take complete control. A built-in search feature makes it easy to find options, and various advanced functions let you intelligently make nuanced adjustments so you can dial in performance just the way you want.

Search Function

Quickly and easily find the option or setting you need.

ASUS User Profile

Port configuration settings between different BIOS versions or share them with friends.

COOLING

PRIME X670 series is engineered with multiple onboard heatsinks and an array of hybrid fan headers to ensure your rig stays cool and stable under intense workloads.

M.2 Heatsink

An M.2 heatsink takes care of the M.2 slot, warding off throttling that can occur with M.2 storage during sustained transfers.

Passive Chipset Heatsink

An aluminum passive chipset heatsink ensures optimal cooling for more stable performance. The passive heatsink approach is more durable and longer-lasting, avoiding dust and dirt build-up problems often encountered by conventional active heatsinks with dedicated fan designs.

Cooler by Design

PRIME X670 series features comprehensive cooling controls that are configurable via Fan Xpert 4 software or via the UEFI BIOS.

Multiple Temperature Sources

Each header can dynamically reference four thermal sensors. Fan Xpert 4 allows you to map the temperature of supported ASUS graphics cards to optimize cooling for GPU- and CPU-intensive tasks.

Smart Protection

A dedicated integrated circuit protects each fan header from overheating and overcurrent.

4-Pin PWM/DC Fan

Each onboard header supports auto-detection of PWM or DC fans.

PERFORMANCE

The PRIME X670 series is built to handle the high core counts and bandwidth demands of AMD processors. ASUS X670 motherboard provides all the fundamentals to boost daily productivity, so your system will be ready for action with stable power, intuitive cooling and flexible data transfer options.

Robust Power Design

Stable power is essential to extract every last bit of performance out of AMD processors. The PRIME X670-P is geared to cater to the demands of these high-core-count CPUs.

ProCool Connectors

Proprietary connectors augment the motherboard’s link to the PSU with 4 pin+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.

12+2 DrMOS Power Stages

12+2 DrMOS power stages combine high-side and low-side MOSFETS and drivers into packages rated for 60 amperes each, delivering power, efficiency, stability and performance to current and future AMD processors.

Six-Layer PCB Design

Multiple PCB layers optimize heat management for critical components, providing more headroom to push CPUs beyond stock speeds.

Stack Cool 3+

2-ounce copper layers draw heat away from critical components to keep them at their optimal operating temperatures and provide more headroom to push CPUs beyond stock speeds.

Outstanding Audio

Combined onboard features deliver elevated audio
Intelligent design and premium hardware create audio quality unlike anything you’ve ever experienced.